Engineering Analysis And Design
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Engineering Analysis And Design
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Thermal Design Support For Wireless LAN System
Q-Metrics has provided thermal analysis for wireless LAN equipment to ensure that the thermal criteria of the equipment components are not violated under the sometimes harsh environments (i.e., sealed units mounted outdoors in extreme weather conditions and/or in rooms within limited or no cooling). The analysis often begins with the importation of the system configuration from a solids modeling representation. From there, a computational model is created using a thermal analysis tool such as IcepakÔ or Thermal DesktopÔ. These software tools provide the means to compute the airflow patterns and heat conduction via conduction, convection, and radiation. The rapid simulation and analysis of the system allows the system thermal design to be optimized concurrent with the design modifications accomplished for geometry and electronic functionality. The illustrations below provide prototypic output from the analysis showing the temperature distribution and flow patterns for the finned area of the wireless equipment housing.
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In
this era of the Internet and high speed communications/data sharing, a local
area network (LAN) system is as much a part of any modern business environment
as is a computer or telephone. Wireless LAN systems are being developed to
address the prohibitive infrastructure costs associated with setting up and
maintaining a LAN as businesses rapidly expand and/or re-configure themselves.
